Title:
The thermoplastic constituent for using it, when forming a laser direct structured board
Document Type and Number:
Japanese Patent JP6152114
Kind Code:
B2
Abstract:
A thermoplastic composition that contains a unique combination of a thermotropic liquid crystalline polymer, dielectric material, laser activatable additive, and a fibrous filler is provided. The nature of the components and/or their concentration are selectively controlled in the present invention to maintain a high dielectric constant, good mechanical properties (e.g., deflection under load), and good processibility (e.g., low viscosity), yet still be laser activatable. Thus, the thermoplastic composition can be readily shaped into a thin substrate and subsequently applied with one or more conductive elements using a laser direct structuring process (“LDS”).
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Inventors:
Young, Paul Sea
Luo, Ron
Luo, Ron
Application Number:
JP2014539981A
Publication Date:
June 21, 2017
Filing Date:
October 23, 2012
Export Citation:
Assignee:
Ticona LRC
International Classes:
C08L101/12; C08K3/04; C08K3/22; C08K7/02; C08K7/14; C08K9/04; C08L67/03; C08L67/04; C23C18/20; H01Q1/38
Domestic Patent References:
| JP2013544296A | ||||
| JP2010535645A | ||||
| JP2011021178A | ||||
| JP2009155623A | ||||
| JP63301258A | ||||
| JP2014074160A |
Foreign References:
| US20090292051 | ||||
| WO2011106252A1 |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Yoshida Juri
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Yoshida Juri