Title:
A thermosetting resin composition, pre-preg using this, a laminate sheet, a printed wired board
Document Type and Number:
Japanese Patent JP6259557
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition excellent in especially adhesive strength for copper foil, high chemical resistance, high thermal resistance and low thermal expansion; and a prepreg, a laminated sheet and a printed wiring board including the same.SOLUTION: There are provided a thermosetting resin composition comprising (a) a maleimide compound having at least two N-substituted maleimide groups in one molecular structure and (b) a silicone compound of an amine equivalent of 500 or more and 2,300 or less having at least one amino group in one molecular structure; and a prepreg, a laminated sheet and a printed wiring board including the same.
Inventors:
Nagai Shunsuke
Masato Miyatake
Tomohiko Kotake
Hashimoto Shintaro
Inoue Yasuo
Shin Takanezawa
Murai Yo
Masato Miyatake
Tomohiko Kotake
Hashimoto Shintaro
Inoue Yasuo
Shin Takanezawa
Murai Yo
Application Number:
JP2012149847A
Publication Date:
January 10, 2018
Filing Date:
July 03, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L83/08; B32B5/28; B32B27/00; B32B27/20; B32B27/34; C08G59/56; C08J5/24; C08K3/00; C08K5/13; C08K5/3415; C08L61/14; C08L63/00; C08L101/00; H05K1/03
Domestic Patent References:
| JP6145536A | ||||
| JP2010248473A |
Attorney, Agent or Firm:
Tamotsu Otani