Title:
便座
Document Type and Number:
Japanese Patent JP6967699
Kind Code:
B2
Abstract:
A molded body (3) which contains a base resin (4) and an olefin wax (5), and which is provided with an olefin wax layer (5A) that is formed in at least a part of the surface of the molded body (3) during the molding. This molded body (3) is configured such that the thickness of the olefin wax layer (5A) is more than 0 but less than 500 nm. Specifically, a thin olefin wax layer (5A) is effectively exposed in the surface of a molded body (3) during the molding. Consequently, the present invention enables the achievement of a molded body (3) that has a surface onto which liquid droplet dirt is not likely to adhere, while maintaining the appearance of a base resin (4) and without increasing the number of steps.
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Inventors:
Chie Hirai
Fumie Horibata
Ukimoto Daiki
Akihiro Umeda
Fumie Horibata
Ukimoto Daiki
Akihiro Umeda
Application Number:
JP2017217404A
Publication Date:
November 17, 2021
Filing Date:
November 10, 2017
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
A47K13/30
Domestic Patent References:
| JP2007007108A | ||||
| JP2001258793A | ||||
| JP2013108070A | ||||
| JP2004083886A |
Attorney, Agent or Firm:
Kenji Kamada
Koichi Nomura
Koichi Nomura