Title:
TRANSFER METHOD AND TRANSFER DEVICE FOR SUBSTRATE
Document Type and Number:
Japanese Patent JP2016207847
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a transfer method and a transfer device that enables substrate transfer that can minimize a contact surface of a substrate and a transfer mechanism with a very simple mechanism.SOLUTION: At a curvature formation part 204, a substrate 104 supplied to a substrate supply part 202 is deformed in a curved shape projecting upward while the substrate 104 is transferred in a transfer direction. A plurality of sets of pairs of rollers 105 that configure the curvature formation part 204, are configured so that an interval of the pairs of rollers 105 becomes narrower gradually as they go to the downstream in the transfer direction, from an interval of the pairs of rollers 105 at the substrate supply part 202, and so that two sides of the substrate 104 abut on a corner of a small diameter part 105A and an end surface 105B to form such a curved state of the substrate 104 that a part of the substrate 104 which is located at the middle of the two sides is displaced upward to the two sides.SELECTED DRAWING: Figure 2
Inventors:
ITO HIROTAKE
KUBO YUJI
IMAMURA TOMOHIRO
KUBO YUJI
IMAMURA TOMOHIRO
Application Number:
JP2015088040A
Publication Date:
December 08, 2016
Filing Date:
April 23, 2015
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H01L21/677; B65G49/06
Attorney, Agent or Firm:
Shigeru Noda