Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
高アスペクト比を有する微細構造体のパターン倒壊抑制用処理液およびこれを用いた微細構造体の製造方法
Document Type and Number:
Japanese Patent JP6405610
Kind Code:
B2
More Like This:
JP5471886High temperature, high pressure processing method and high temperature, high pressure processing equipment and storage medium
JPH11625APPARATUS FOR WASHING WAFER
JP2018095836CMP POLISHING COMPOSITION COMPRISING POSITIVE AND NEGATIVE SILICA PARTICLES
Inventors:
Aoyama Kimihiro
Yuji Matsunaga
Application Number:
JP2013197821A
Publication Date:
October 17, 2018
Filing Date:
September 25, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
H01L21/304
Domestic Patent References:
JP2013102109A
Foreign References:
WO2012027667A1
Attorney, Agent or Firm:
Hiroshi Kobayashi
Kyoei Sugiyama
Kyoko Tamura
Yasuhito Suzuki



 
Previous Patent: インダクタ素子およびその製造方法

Next Patent: 放射性廃棄物処分施設及びその施工方法