Title:
The unelectrolyzed metal depositing method for having used high alkalinity Plating bath
Document Type and Number:
Japanese Patent JP5937086
Kind Code:
B2
Abstract:
A plating process using an electroless plating bath formed from two separate prepared component solutions. The component solutions mixed within 120 hours prior to plating operations, to provide a highly alkaline plating bath solution. One component solution of the two-part plating bath, is provided with a metal salt or source of plating ions, and which is initially kept in a separate solution from the second other prepared component solution. The second component solution contains formaldehyde, and preferably paraformaldehyde, used to reduce the metal salts into the metal to be deposited on a substrate. Each component solution further includes sodium hydroxide in concentrations selected so that when the two solutions are preferably mixed the final plating bath solution has a pH greater than 11.5.
Inventors:
Shrezinger, Mordecai
Peter, Robert Andrew
Peter, Robert Andrew
Application Number:
JP2013533061A
Publication Date:
June 22, 2016
Filing Date:
October 12, 2011
Export Citation:
Assignee:
University of Windsor
International Classes:
C23C18/50; C23C18/34
Domestic Patent References:
| JP2019472A | ||||
| JP5295556A | ||||
| JP7034254A |
Attorney, Agent or Firm:
Atomi International Patent Office