Title:
A wafer processor which has a heating type rotation board base material
Document Type and Number:
Japanese Patent JP6095291
Kind Code:
B2
Abstract:
A semiconductor substrate processing apparatus (1), comprising a substrate support assembly (30), including a substrate support (32) defining an outer support surface (34) for supporting a substrate or substrate carrier (24) thereon, and a heater (50) comprising a heat dissipating portion (54) that is disposed within the substrate support (32) and that extends underneath and substantially parallel to the support surface (34), said substrate support (32) being rotatably mounted around a rotation axis (L) that extends through said support surface (34), such that the support surface (34) is rotatable relative to the heat dissipating portion (54) of the heater (50).
Inventors:
Derridell, Chris Hee. M.
Bornstra, Kraspage.
Austell-Laken, Theodorshe. M.
Ravenhorst, Valent Yeh.
Bornstra, Kraspage.
Austell-Laken, Theodorshe. M.
Ravenhorst, Valent Yeh.
Application Number:
JP2012168882A
Publication Date:
March 15, 2017
Filing Date:
July 12, 2012
Export Citation:
Assignee:
ASM International N.V.
International Classes:
H01L21/683; H01L21/31
Domestic Patent References:
| JP2003218040A | ||||
| JP2001156005A |
Attorney, Agent or Firm:
Patent Business Corporation Takewa International Patent Office