Title:
A wafer rise-and-fall device, a manufacturing method of an epitaxial wafer
Document Type and Number:
Japanese Patent JP6112474
Kind Code:
B2
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Inventors:
Kazunari Suda
Application Number:
JP2013099565A
Publication Date:
April 12, 2017
Filing Date:
May 09, 2013
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/683; H01L21/205
Domestic Patent References:
| JP2003100855A | ||||
| JP63142829A | ||||
| JP2005260095A | ||||
| JP2010073753A |
Foreign References:
| US20060156987 | ||||
| US7204888 | ||||
| US20040241992 |
Attorney, Agent or Firm:
Ryuji Harikawa