Title:
The wire two Daiko nectar constituted so that it might combine with Die Package provided with a Daito wire connector, and Die Package
Document Type and Number:
Japanese Patent JP6196396
Kind Code:
B2
Abstract:
Some novel features pertain to an integrated device package (e.g., die package) that includes a package substrate, a die, an encapsulation layer and a first set of metal layers. The package substrate includes a first surface and a second surface. The die is coupled to the first surface of the package substrate. The encapsulation layer encapsulates the die. The first set of metal layers is coupled to a first exterior surface of the encapsulation layer. In some implementations, the first set of metal layers is configured to operate as a die-to-wire connector of the integrated device package. In some implementations, the integrated device package includes a second set of metal layers coupled to the second surface of the package substrate. In some implementations, the integrated device package includes a second set of metal layers coupled to a second exterior surface of the encapsulation layer.
Inventors:
Dike Daniel Kim
Mario Francisco Velez
Junghae Kim
Matthew Michael Nowak
Change et zuo
Changhan Hobby Yun
David Francis Birdie
Robert Paul Mickleka
Mario Francisco Velez
Junghae Kim
Matthew Michael Nowak
Change et zuo
Changhan Hobby Yun
David Francis Birdie
Robert Paul Mickleka
Application Number:
JP2016562526A
Publication Date:
September 13, 2017
Filing Date:
April 14, 2015
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
H01L23/32
Domestic Patent References:
| JP10079461A | ||||
| JP2004363566A | ||||
| JP2005252134A |
Foreign References:
| US20080001266 | ||||
| US20080169557 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Kuroda Shinpei
Kuroda Shinpei
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