Title:
A wiring board and its mounting structure object
Document Type and Number:
Japanese Patent JP5988372
Kind Code:
B2
Inventors:
Kei Hayashi
Application Number:
JP2012254888A
Publication Date:
September 07, 2016
Filing Date:
November 21, 2012
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/46
Domestic Patent References:
| JP2011159649A |
Foreign References:
| WO2011037260A1 |
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