WIRING BOARD AND MANUFACTURING METHOD THEREOF

Title:

WIRING BOARD AND MANUFACTURING METHOD THEREOF

Document Type and Number:

Japanese Patent JP2018085375

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To provide a wiring board capable of lowering a dielectric constant between a pair of opposing electrodes as compared with the related art.SOLUTION: Conductive circuit layers 22 and 42 included in a wiring board 50 are respectively provided with a first counter electrode 17 and a second counter electrode 48 that face each other. A hollow part 37 is provided between the first and second counter electrodes 17 and 48. The wiring board 50 is divided into two parts, which is a first board 10 including the first counter electrode 17 and a second board 40 including the second counter electrode 48, and the first board 10 and the second board 40 are fixed by solder 38.SELECTED DRAWING: Figure 2

Inventors:

KAJIWARA KAZUKI
MUKUHASHI NAOKI

Application Number:

JP2016226038A

Publication Date:

May 31, 2018

Filing Date:

November 21, 2016

Export Citation:

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Assignee:

IBIDEN CO LTD

International Classes:

H05K3/46; H05K1/14

Attorney, Agent or Firm:

Hiroshi Matsuura
Toshida Ikeda
Axami Kanako

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