Title:
Wiring board and its manufacturing method
Document Type and Number:
Japanese Patent JP6334363
Kind Code:
B2
Inventors:
Tomohiro Nitta
Application Number:
JP2014220120A
Publication Date:
May 30, 2018
Filing Date:
October 29, 2014
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/46; H05K1/03
Domestic Patent References:
| JP2005217029A | ||||
| JP8321679A | ||||
| JP4282894A | ||||
| JP2009021470A | ||||
| JP2008135469A |
Foreign References:
| WO2008096540A1 | ||||
| WO2013140812A1 |
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