Title:
配線基板
Document Type and Number:
Japanese Patent JP7354573
Kind Code:
B2
Abstract:
To provide a wiring board with small thickness variation and to increase the yield when fine wiring is formed.SOLUTION: A wiring board consists of: an organic core material alone; a resin composition layer formed on an organic core material; or a resin composition layer alone, in which a difference between the thickness of the thickest portion and the thickness of the thinnest portion in an area of 2500 mm2 is controlled 8 μm or less by surface polishing means. It is preferable that the surface polishing means is any one or more of a chemical mechanical polishing method, a mechanical polishing method, an electrolytic polishing method, and a chemical polishing method.SELECTED DRAWING: Figure 1
Inventors:
Shunsuke Ohtake
Mitsukura and his group
Kazuhiko Kurabuchi
Takashi Masuko
Hiroaki Fujita
Masahisa Oze
Mitsukura and his group
Kazuhiko Kurabuchi
Takashi Masuko
Hiroaki Fujita
Masahisa Oze
Application Number:
JP2019075529A
Publication Date:
October 03, 2023
Filing Date:
April 11, 2019
Export Citation:
Assignee:
Resonac Co., Ltd.
International Classes:
H05K3/38; H05K3/46
Domestic Patent References:
| JP2003051567A | ||||
| JP8153951A | ||||
| JP2015065295A | ||||
| JP2006210565A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano