Title:
1K HIGH TEMPERATURE DEBONDABLE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2016/101129
Kind Code:
A1
Abstract:
Disclosed is a 1k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate, the adhesives composition comprising (a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups, and (b) mercapto-crosslinker. The adhesive composition is cured by UV/Vis/LED or thermal or combined and is cured faster requiring lower energy. Also disclosed are assemblies including such an adhesive and methods of using the adhesives.
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Inventors:
HYNES STEPHEN (CN)
SUN CHUNYU (CN)
OUYANG JIANGBO (US)
CHEN JINQIAN (CN)
SUN CHUNYU (CN)
OUYANG JIANGBO (US)
CHEN JINQIAN (CN)
Application Number:
PCT/CN2014/094613
Publication Date:
June 30, 2016
Filing Date:
December 23, 2014
Export Citation:
Assignee:
HENKEL CHINA CO LTD (CN)
HENKEL CORP (US)
HENKEL CORP (US)
International Classes:
C09J183/05; B32B7/12; C09J5/06; C09J183/07
Domestic Patent References:
| WO2002014451A1 | 2002-02-21 | |||
| WO2013012973A2 | 2013-01-24 |
Foreign References:
| EP1728829A1 | 2006-12-06 |
Attorney, Agent or Firm:
NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD. (18th Floor Block A,Investment Plaza, 27 Jinrongdajie, Xicheng District, Beijing 3, CN)
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