1K HIGH TEMPERATURE DEBONDABLE ADHESIVE

Title:

1K HIGH TEMPERATURE DEBONDABLE ADHESIVE

Document Type and Number:

WIPO Patent Application WO/2016/101785

Kind Code:

A1

Abstract:

The present invention provides a1 k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate, the adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si-H hydrogens on a silane or siloxane having terminal Si-H groups, and (b) mercapto-crosslinker. The adhesive composition is cured by UV/Vis/LED or thermal or combined and is cured faster requiring lower energy. The present invention also provides assemblies including such an adhesive and methods of using the adhesives.

Inventors:

HYNES STEPHEN (CN)
SUN CHUNYU (CN)
OUYANG JIANGBO (US)
CHEN JINQIAN (CN)

Application Number:

PCT/CN2015/096670

Publication Date:

June 30, 2016

Filing Date:

December 08, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HENKEL CHINA CO LTD (CN)
HENKEL CORP (US)

International Classes:

C09J183/05; B32B7/12; C09J5/06; C09J183/07

Domestic Patent References:

WO2013181801A1	2013-12-12
WO2013012973A2	2013-01-24
WO2012129766A1	2012-10-04

Foreign References:

CN103897398A	2014-07-02
EP0400852A2	1990-12-05
EP1728829B1	2007-11-07
CN102876249A	2013-01-16
CN104119832A	2014-10-29
CA2720238A1	2009-11-12

Other References: