Title:
2,2-BIS(3-ALLYL-4-HYDROXYPHENYL)PROPANE
Document Type and Number:
WIPO Patent Application WO/2007/026754
Kind Code:
A1
Abstract:
A high-purity 2,2-diallylbisphenol A which is easy to handle and is solid. It is
for use as raw materials for electronic materials, such as a hardener for semiconductor encapsulation
materials and an additive for polyimide resins. It is a 2,2-bis(3-allyl-4-hydroxyphenyl)propane which
is solid at 30°C and represented by the formula (1). [Chemical formula 1]
(1) The solid 2,2-diallylbisphenol A is obtained by subjecting liquid 2,2-diallylbisphenol A
obtained through Claisen rearrangement to purification by an alkali treatment to
obtain liquid 2,2-diallylbisphenol A having a purity of about 95 wt.% or higher and
adding seed crystals to the purified compound to crystallize it.
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Inventors:
MINAKAMI RYUUZOH (JP)
Application Number:
PCT/JP2006/317087
Publication Date:
March 08, 2007
Filing Date:
August 30, 2006
Export Citation:
Assignee:
API CORP (JP)
MINAKAMI RYUUZOH (JP)
MINAKAMI RYUUZOH (JP)
International Classes:
C07C39/21
Domestic Patent References:
WO2006059774A1 | 2006-06-08 |
Foreign References:
JPH11140007A | 1999-05-25 | |||
JP2000191575A | 2000-07-11 | |||
JP2000080054A | 2000-03-21 | |||
US2910455A | 1959-10-27 | |||
JPH05155798A | 1993-06-22 |
Attorney, Agent or Firm:
OKADA, Kazuhiko (6F Kudan Kangyou Bldg., 10-1, Kudan-kita 1-chom, Chiyoda-ku Tokyo 73, JP)
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