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Title:
2,2-BIS(3-ALLYL-4-HYDROXYPHENYL)PROPANE
Document Type and Number:
WIPO Patent Application WO/2007/026754
Kind Code:
A1
Abstract:
A high-purity 2,2-diallylbisphenol A which is easy to handle and is solid. It is for use as raw materials for electronic materials, such as a hardener for semiconductor encapsulation materials and an additive for polyimide resins. It is a 2,2-bis(3-allyl-4-hydroxyphenyl)propane which is solid at 30°C and represented by the formula (1). [Chemical formula 1] (1) The solid 2,2-diallylbisphenol A is obtained by subjecting liquid 2,2-diallylbisphenol A obtained through Claisen rearrangement to purification by an alkali treatment to obtain liquid 2,2-diallylbisphenol A having a purity of about 95 wt.% or higher and adding seed crystals to the purified compound to crystallize it.

Inventors:
MINAKAMI RYUUZOH (JP)
Application Number:
PCT/JP2006/317087
Publication Date:
March 08, 2007
Filing Date:
August 30, 2006
Export Citation:
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Assignee:
API CORP (JP)
MINAKAMI RYUUZOH (JP)
International Classes:
C07C39/21
Domestic Patent References:
WO2006059774A12006-06-08
Foreign References:
JPH11140007A1999-05-25
JP2000191575A2000-07-11
JP2000080054A2000-03-21
US2910455A1959-10-27
JPH05155798A1993-06-22
Attorney, Agent or Firm:
OKADA, Kazuhiko (6F Kudan Kangyou Bldg., 10-1, Kudan-kita 1-chom, Chiyoda-ku Tokyo 73, JP)
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