Title:
ABNORMALITY DETERMINING DEVICE, LASER PROCESSING MACHINE, AND ABNORMALITY DETERMINING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/014335
Kind Code:
A1
Abstract:
[Problem] To provide an abnormality determining device, a laser processing machine, and an abnormality determining method capable of accurately determining a processing abnormality with respect to a workpiece. [Solution] An abnormality determining device (3) for determining a processing abnormality on a workpiece W, the device comprising: a storage unit (41) that, when a moving unit (12) moves and a processing unit (20) performs normal processing on a workpiece W while moving with respect to the workpiece W, associates and stores a state quantity detected by a sensor unit (30) with a movement-related value acquired by an acquiring unit (40); a calculating unit (42) that calculates the normal range of a state quantity for each movement-related value on the basis of information stored in the storage unit (41); and a determining unit (43) that determines, on the basis of the calculation results by the calculating unit (42), whether the state quantity detected by the sensor unit (30) after the normal range has been calculated is within the normal range.
Inventors:
HASHIMOTO SHOGO (JP)
Application Number:
PCT/JP2023/024579
Publication Date:
January 18, 2024
Filing Date:
July 03, 2023
Export Citation:
Assignee:
MURATA MACHINERY LTD (JP)
International Classes:
B23K26/00; B23K26/03; B23K26/08; B23K31/00
Domestic Patent References:
| WO2019159659A1 | 2019-08-22 |
Foreign References:
| JP2018079502A | 2018-05-24 | |||
| JP2000153379A | 2000-06-06 | |||
| JP2017113789A | 2017-06-29 |
Attorney, Agent or Firm:
NISHI, Kazuya (JP)
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