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Title:
ABRASION METHOD AND DEVICE, AND DIE
Document Type and Number:
WIPO Patent Application WO/2013/069440
Kind Code:
A1
Abstract:
In this abrasion method for abrading the surface layer of a workpiece by means of a punch press which is provided with a punch holder having a vertically moveable abrasion tool and with a die holder having a die with a die hole, the workpiece is held in a state in which a through-hole pre-formed in the vicinity of the abrasion portion of the workpiece is made to communicate with the die hole of the die, and, at the same time as the abrasion portion of the workpiece is abraded by means of the abrasion tool, abrasion dust generated by the abrasion is sucked into the die hole via the through-hole. This abrasion method makes it possible to recover abrasion dust generated by abrasion without scattering said dust in the surroundings.

Inventors:
IWAMOTO MASAMI (JP)
OOTSUKA YASUYUKI (JP)
SEKI MASAYUKI (JP)
Application Number:
PCT/JP2012/077210
Publication Date:
May 16, 2013
Filing Date:
October 22, 2012
Export Citation:
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Assignee:
AMADA CO LTD (JP)
International Classes:
B21D28/36; B23Q11/00; B24B55/06; B24D13/14
Foreign References:
JP2006123063A2006-05-18
JPH10235434A1998-09-08
JP2007000901A2007-01-11
JP2010069615A2010-04-02
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
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Claims: