Title:
ABRASIVE GRAINS FOR POLISHING HARD METAL MATERIAL, POLISHING COMPOSITION AND METHOD FOR MANUFACTURING HARD METAL PRODUCT
Document Type and Number:
WIPO Patent Application WO/2016/052161
Kind Code:
A1
Abstract:
Provided are abrasive grains that are to be supplied to a polishing table for polishing a hard metal material at a higher efficiency. The abrasive grains have an average grain size of 2-10 μm and show a holding rate to the polishing table of 5-60%. Also provided are a polishing composition comprising the abrasive grains and a method for manufacturing a hard metal material using the composition.
Inventors:
MIWA NAOYA (JP)
ASHITAKA KEIJI (JP)
KOJIMA RYUJI (JP)
ASHITAKA KEIJI (JP)
KOJIMA RYUJI (JP)
Application Number:
PCT/JP2015/076036
Publication Date:
April 07, 2016
Filing Date:
September 14, 2015
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; B24B37/14
Domestic Patent References:
| WO2009034924A1 | 2009-03-19 |
Foreign References:
| JP2012166326A | 2012-09-06 | |||
| JP2014117794A | 2014-06-30 | |||
| JP2005518091A | 2005-06-16 | |||
| JP2004508947A | 2004-03-25 | |||
| JP2010522093A | 2010-07-01 | |||
| JP2002283218A | 2002-10-03 | |||
| JP2002060777A | 2002-02-26 |
Attorney, Agent or Firm:
ABE MAKOTO (JP)
Makoto Abe (JP)
Makoto Abe (JP)
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