Title:
ABRASIVE MEDIUM FOR BARREL POLISHING
Document Type and Number:
WIPO Patent Application WO/2012/137713
Kind Code:
A1
Abstract:
[Problem] To provide an abrasive medium for barrel polishing which does not cause blow marks on a target object (workpiece) after making contact with the workpiece and does not vary largely in a contact state with the workpiece according to the time of a polishing process. [Solution] The abrasive medium is formed of a mixture prepared by dispersing particles in a resin base. The abrasive medium has a granular shape formed by: a cylindrical linear body part having an end surface as a bottom surface; and a diameter reduction part extending from the other end surface of the linear body part with a continuously reducing diameter, wherein an intersection between the bottom surface and a lateral surface of the linear body part, a boundary between the linear body part and the diameter reduction part, a vertical section of the diameter reduction part including the apex of the diameter reduction part are convex.
Inventors:
KASHIMA SHINYA (JP)
Application Number:
PCT/JP2012/058872
Publication Date:
October 11, 2012
Filing Date:
April 02, 2012
Export Citation:
Assignee:
SINTOKOGIO LTD (JP)
KASHIMA SHINYA (JP)
KASHIMA SHINYA (JP)
International Classes:
B24B31/14; C09K3/14
Foreign References:
| US4765100A | 1988-08-23 | |||
| US4712333A | 1987-12-15 | |||
| US4652469A | 1987-03-24 |
Attorney, Agent or Firm:
YAMASAKI, Yukuzo et al. (JP)
Yukuzo Yamazaki (JP)
Yukuzo Yamazaki (JP)
Download PDF:
Claims:
Previous Patent: LIQUID CRYSTAL DISPLAY DEVICE
Next Patent: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Next Patent: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE