Title:
ABRASIVE PAD
Document Type and Number:
WIPO Patent Application WO/2016/047802
Kind Code:
A1
Abstract:
The present invention provides a polishing pad with which it is possible to improve polishing accuracy and minimize polishing unevenness when the surface of a to-be-polished object of varying thickness is polished. A polishing pad (1) is formed by bonding at least two sheets together, the two sheets being a lower layer sheet (5) and an upper layer sheet (3) having a polishing surface (9). The thickness of the upper layer sheet is 1.0-2.0 mm, the Shore A hardness of the polishing surface (9) is 20-90, and the hardness at 25% compression as measured using a 10-mm indenter with respect to the entire polishing pad (1) is 0.35 MPa.
Inventors:
TAKAHASHI DAISUKE (JP)
TAKADA NAOKI (JP)
MAEDA NORITAKA (JP)
TAKADA NAOKI (JP)
MAEDA NORITAKA (JP)
Application Number:
PCT/JP2015/077310
Publication Date:
March 31, 2016
Filing Date:
September 28, 2015
Export Citation:
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/22; B24B37/24
Foreign References:
| JP2013082029A | 2013-05-09 | |||
| JP2004323679A | 2004-11-18 | |||
| US20100247868A1 | 2010-09-30 | |||
| JP2005072496A | 2005-03-17 |
Attorney, Agent or Firm:
NISHIJIMA Takaki et al. (JP)
Takayoshi Nishijima (JP)
Takayoshi Nishijima (JP)
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