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Title:
ABRASIVE PARTICLE-ASSISTED LASER ELECTROLYSIS SELF-COUPLING COLLABORATIVE ALIGNMENT DRILLING METHOD AND SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/137820
Kind Code:
A1
Abstract:
The present invention relates to the field of non-traditional machining. Disclosed are an abrasive particle-assisted laser electrolysis self-coupling collaborative alignment drilling method and system. Short pulse laser "point-scanning" is used to implement etching at a specified position on the upper surface of a semiconductor material, and cavitation of the laser in a solution is used to drive abrasive particles to impact and scratch the surface under machining, thereby improving the quality of the surface; moreover, laser irradiation induces generation of a local conductivity enhancement region in the material, and an instantaneous localized conductive channel through which a current preferentially passes is formed; on the back of the semiconductor material, electrolytic machining of a laser scanning position is carried out by using a cathode needle tube, an electrolyte with the abrasive particles is ejected from the cathode needle tube at a certain pressure, and a passivation layer on a lower surface of the semiconductor material is damaged by an impact action of the abrasive particles, so that electrolysis is continuously and efficiently performed in the local conductivity enhancement region, and micropore pairs at corresponding positions are formed on the upper surface and the lower surface of the semiconductor material. According to the present invention, a micropore structure having good surface quality and strict correspondence between upper and lower positions may be obtained.

Inventors:
ZHU HAO (CN)
HAN JINCAI (CN)
JIANG ZIXUAN (CN)
XU KUN (CN)
ZHAO DOUYAN (CN)
ZHANG ZHAOYANG (CN)
LIU YANG (CN)
GAO JIAN (CN)
Application Number:
PCT/CN2022/077233
Publication Date:
July 27, 2023
Filing Date:
February 22, 2022
Export Citation:
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Assignee:
UNIV JIANGSU (CN)
International Classes:
B23H5/06; B23H11/00; B23K26/0622; B23K26/082; B23K26/362; B23K26/70
Foreign References:
CN113146066A2021-07-23
CN108526627A2018-09-14
CN110153515A2019-08-23
CN109732199A2019-05-10
CN112171184A2021-01-05
CN106424987A2017-02-22
JPH07285071A1995-10-31
Attorney, Agent or Firm:
NANJING DOYES INTELLECTUAL PROPERTY CO., LTD. (CN)
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