Title:
ACCELERATION SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/264796
Kind Code:
A1
Abstract:
This acceleration sensor includes: a semiconductor substrate having a cavity formed in the interior thereof; a fixed structure including a fixed electrode supported by the semiconductor substrate in a state of floating in the cavity; and a movable structure including a movable electrode supported by the semiconductor substrate via an elastic structure in a state of floating in the cavity, the movable electrode being displaced relative to the fixed electrode. The elastic structure includes a first end section supported by the semiconductor substrate, a second end section connected to the movable structure, and an intermediate section connecting the first and second end sections. The elastic structure also has a linear portion extending linearly in at least part of the intermediate section. The linear portion is provided with a plurality of linear frames extending parallel to each other in the direction in which the linear portion extends.
Inventors:
MIYABUCHI HIROKI (JP)
Application Number:
PCT/JP2022/021988
Publication Date:
December 22, 2022
Filing Date:
May 30, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
G01P15/125; G01P15/08; G01P15/18
Foreign References:
| JP2019049434A | 2019-03-28 | |||
| JP2010210424A | 2010-09-24 | |||
| JP2005527384A | 2005-09-15 | |||
| EP0877255A1 | 1998-11-11 | |||
| CN101089625A | 2007-12-19 | |||
| JP2021053714A | 2021-04-08 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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