ACCURACY MANAGEMENT METHOD, ACCURACY MANAGEMENT SYSTEM, MANAGEMENT DEVICE, ANALYSIS DEVICE, AND METHOD FOR DETERMINING ABNORMALITY IN ACCURACY MANAGEMENT

WIPO Patent Application WO/2018/142871

A1

Provided are an accuracy management method, an accuracy management system, a management device, an analysis device, and a method for determining an abnormality in accuracy management, whereby the quality of accuracy management can be increased by adequately utilizing measurement results for both an accuracy management material and a sample. An accuracy management method used by a management device 30 connected via a network 13 to analysis devices 20 installed in each of a plurality of facilities 12, wherein first accuracy management information obtained by measurement of an artificially generated accuracy management material by the analysis device 20 of each facility 12 and second accuracy management information obtained by measurement of a plurality of samples are acquired via the network 13 from the analysis device 20 of each facility 12, and information relating to accuracy management of the analysis device 20 of at least one facility 12 is outputted on the basis of the acquired first accuracy management information and the second accuracy management information.

FUJIMOTO KEIJI (JP)
MATSUOKA KAZUHIKO (JP)
HASUI YASUSHI (JP)

PCT/JP2018/000485

August 09, 2018

January 11, 2018

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SYSMEX CORP (JP)

G01N35/00; G01N15/14

JP2006017600A	2006-01-19
JP2009243978A	2009-10-22
JPH08233825A	1996-09-13
JP2007248090A	2007-09-27
JP2008032751A	2008-02-14
JP2015010939A	2015-01-19
JP2009181369A	2009-08-13
JP2004004105A	2004-01-08
JP2007108136A	2007-04-26

See also references of EP 3578993A4

OGASAWARA PATENT OFFICE (JP)

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