Title:
ACID GROUP-CONTAINING (METH)ACRYLATE RESIN AND SOLDER RESIST RESIN MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/186183
Kind Code:
A1
Abstract:
The present invention provides an acid group-containing (meth)acrylate resin comprising, as essential reaction materials, an epoxy resin (A), an unsaturated monocarboxylic acid or a derivative thereof (B), and a polycarboxylic acid anhydride (C), characterized in that the epoxy resin (A) is a reaction product of a starting epoxy resin (a1) having, as an essential component, a polyglycidylether of a bis(hydroxynaphthyl) alkane compound (p1) with a polyhydroxy compound (a2). This acid group-containing (meth)acrylate resin is capable of forming a cured product having superior elongation and thermal resistance.
Inventors:
YAMADA SHUNSUKE (JP)
KAMEYAMA HIROFUMI (JP)
KAMEYAMA HIROFUMI (JP)
Application Number:
PCT/JP2018/011313
Publication Date:
October 11, 2018
Filing Date:
March 22, 2018
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/17; C08F290/06; G03F7/027
Domestic Patent References:
| WO2002024774A1 | 2002-03-28 |
Foreign References:
| JP2001089644A | 2001-04-03 | |||
| JP2006335796A | 2006-12-14 | |||
| JP2010237576A | 2010-10-21 | |||
| JPH04217675A | 1992-08-07 | |||
| JP2017082193A | 2017-05-18 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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