Title:
ACOUSTIC ELEMENT INTEGRATED CIRCUIT, PROBE, AND DIAGNOSIS DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/286805
Kind Code:
A1
Abstract:
[Problem] To provide a highly reliable acoustic element integrated circuit, probe, and diagnosis device with which it is possible to obtain a high-quality two-dimensional image. [Solution] This invention is provided with: a first chip 501 in which a plurality of cells are arranged two-dimensionally on the same curved surface, capacitive acoustic elements having transmission and reception functions being distributed to the respective cells; a second chip 502 on which some of the circuitry of an excitation circuit for driving the portion of the acoustic elements having the transmission function is arranged; a second chip 502 on which a reception circuit for processing a reception signal outputted from the portion of the acoustic elements having the reception function, and the remaining circuitry of the excitation circuit, are arranged; upper-layer inter-chip connection means B0, B1 for connecting the first chip 501 and the second chip 502; and lower-layer inter-chip connection means B21, B22, B23 for connecting the second chip 502 and a third chip 502. The plurality of cells can be made to perform a two-dimensional operation independently of each other by individually controlling the in-cell circuitry.
Inventors:
TADAKI YOSHITAKA (JP)
OGAYA KAORU (JP)
TAKEMOTO YOSHIAKI (JP)
KIKUCHI HIROSHI (JP)
UMEMURA SHIN-ICHIRO (JP)
OGAYA KAORU (JP)
TAKEMOTO YOSHIAKI (JP)
KIKUCHI HIROSHI (JP)
UMEMURA SHIN-ICHIRO (JP)
Application Number:
PCT/JP2022/027566
Publication Date:
January 19, 2023
Filing Date:
July 13, 2022
Export Citation:
Assignee:
MEMS CORE CO LTD (JP)
International Classes:
A61B8/00; H04R1/40
Domestic Patent References:
| WO2005120130A1 | 2005-12-15 | |||
| WO2019182771A1 | 2019-09-26 |
Foreign References:
| JP2004274756A | 2004-09-30 | |||
| JP2021502846A | 2021-02-04 |
Attorney, Agent or Firm:
AMBO Aiko (JP)
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