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Patent Searching and Data


Title:
ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/087957
Kind Code:
A1
Abstract:
The embodiments of the present invention disclose an acoustic wave device. The device comprises: a substrate, and a first electrode layer, a piezoelectric layer, and a second electrode layer sequentially arranged on the substrate. The device further comprises a protective layer, wherein: the protective layer is at least arranged at a first position of the second electrode layer away from a surface of the substrate. The first position is a position on the second electrode layer corresponding to a first overlap region. The first overlap region is a region where an active region of the acoustic wave device is located in a region where the first electrode layer, the second electrode layer, and the piezoelectric layer overlap each other. The embodiments of the present invention further disclose a method for manufacturing the acoustic wave device.

Inventors:
LIN RE-CHING (CN)
LIAO PEI-CHUN (CN)
Application Number:
PCT/CN2019/093405
Publication Date:
May 07, 2020
Filing Date:
June 27, 2019
Export Citation:
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Assignee:
WUHAN YANXI MICRO COMPONENTS CO LTD (CN)
International Classes:
H03H9/15; H03H3/02
Foreign References:
CN109474254A2019-03-15
CN102340287A2012-02-01
CN103930979A2014-07-16
US20100201221A12010-08-12
JP2016039516A2016-03-22
Other References:
See also references of EP 3675357A4
Attorney, Agent or Firm:
CHINA PAT INTELLECTUAL PROPERTY OFFICE (CN)
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