Title:
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/052129
Kind Code:
A1
Abstract:
Provided is an acoustic wave device, which is capable of reducing capacitance between wiring lines, and not susceptible to characteristic deterioration due to parasitic capacitance or the like.
Disclosed is an acoustic wave device 1 wherein a piezoelectric substrate 5 is laminated on a supporting substrate 24, and an IDT electrode 21 is provided on the piezoelectric substrate 5. On the piezoelectric substrate 5, a plurality of wiring sections 16b, 13 are also provided. Below at least one of the wiring sections 16b, 13 and/or below a region between the wiring sections, a first hollow section 31 is provided in the supporting substrate 24.
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Inventors:
OMURA MASASHI (JP)
Application Number:
PCT/JP2015/075733
Publication Date:
April 07, 2016
Filing Date:
September 10, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H3/08; H03H9/64
Domestic Patent References:
| WO2012073871A1 | 2012-06-07 |
Foreign References:
| JP2007312164A | 2007-11-29 | |||
| JP2002152000A | 2002-05-24 | |||
| JP2004236285A | 2004-08-19 | |||
| JP2013223025A | 2013-10-28 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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