Title:
ACOUSTIC WAVE MODULE
Document Type and Number:
WIPO Patent Application WO/2022/181073
Kind Code:
A1
Abstract:
An acoustic wave module (100) comprises an acoustic wave device (110), a mounting substrate (50), a sealing resin (80), and solder bumps (70a, 70b). The acoustic wave device (110) comprises a piezoelectric substrate (10), a function element (60), a support portion (20), a cover portion (30), wiring patterns (62a, 62b), cover wires (69a, 69b), and through electrodes (64a, 64b). The piezoelectric substrate (10), the support portion (20), and the cover portion (30) form a hollow space (Ar). A surface (S1) of the piezoelectric substrate (10) is exposed from the sealing resin (80). The solder bumps (70a, 70b) are formed at positions that do not overlap the through electrodes (64a, 64b) when the acoustic wave device (100) is seen in plan view.
Inventors:
KAWASAKI KOICHIRO (JP)
Application Number:
PCT/JP2022/000477
Publication Date:
September 01, 2022
Filing Date:
January 11, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/02; H03H9/25
Domestic Patent References:
| WO2014013831A1 | 2014-01-23 | |||
| WO2021010164A1 | 2021-01-21 | |||
| WO2020130051A1 | 2020-06-25 | |||
| WO2018143045A1 | 2018-08-09 | |||
| WO2019044309A1 | 2019-03-07 |
Foreign References:
| JP2012182604A | 2012-09-20 | |||
| JP2016123020A | 2016-07-07 | |||
| JP2015156626A | 2015-08-27 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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