Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/022088
Kind Code:
A1
Abstract:
The present invention provides: an actinic ray-sensitive or radiation-sensitive resin composition containing a polymer (A) having a specific group, and a polymer (B) having a group that is decomposed and has the polarity thereof increased by the action of an acid, wherein Mz/Mw is 1.4 or less, where Mw is the weight-average molecular weight of the polymer (A), and Mz is the Z-average molecular weight of the polymer (A); an actinic ray-sensitive or radiation-sensitive film using the actinic ray-sensitive or radiation-sensitive resin composition; a method for forming a pattern; and a method for manufacturing an electronic device.
Inventors:
KAWABATA TAKESHI (JP)
YOSHIMURA TSUTOMU (JP)
GOTO AKIYOSHI (JP)
TANGO NAOHIRO (JP)
OU KEIYU (JP)
MARUMO KAZUHIRO (JP)
YOSHIMURA TSUTOMU (JP)
GOTO AKIYOSHI (JP)
TANGO NAOHIRO (JP)
OU KEIYU (JP)
MARUMO KAZUHIRO (JP)
Application Number:
PCT/JP2019/027563
Publication Date:
January 30, 2020
Filing Date:
July 11, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08F20/22; C08F20/28; G03F7/039; G03F7/20
Domestic Patent References:
| WO2018043122A1 | 2018-03-08 |
Foreign References:
| JP2010139996A | 2010-06-24 | |||
| JP2008304773A | 2008-12-18 | |||
| JP2011191446A | 2011-09-29 | |||
| JP2010256879A | 2010-11-11 | |||
| JP2011048111A | 2011-03-10 | |||
| JP2011227405A | 2011-11-10 | |||
| JP2011253017A | 2011-12-15 | |||
| JP2012008500A | 2012-01-12 | |||
| JP2012073402A | 2012-04-12 | |||
| JP2011053430A | 2011-03-17 | |||
| JP2013129837A | 2013-07-04 | |||
| JP2011209520A | 2011-10-20 | |||
| JP2011100105A | 2011-05-19 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
Download PDF: