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Title:
ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, METHOD FOR PRODUCING ELECTRONIC DEVICE, COMPOUND, AND RESIN
Document Type and Number:
WIPO Patent Application WO/2022/158338
Kind Code:
A1
Abstract:
Provided is an actinic-ray-sensitive or radiation-sensitive resin composition that, when forming an ultra-fine pattern (for example a line and space pattern of 30 nm or less, a hole pattern with a hole diameter of 30 nm or less, or the like), is superior in terms of roughness performance, and that can suppress the occurrence of defects in a pattern. Said actinic-ray-sensitive or radiation-sensitive resin composition contains: a resin that has a repeating unit derived from a compound represented by general formula (1); and a compound that generates an acid when irradiated with actinic rays or radiation.

Inventors:
YOSHIMURA TSUTOMU (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
KURUMISAWA YUMA (JP)
Application Number:
PCT/JP2022/000606
Publication Date:
July 28, 2022
Filing Date:
January 11, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F20/12; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2020158417A12020-08-06
WO2014002808A12014-01-03
Foreign References:
JP2004083900A2004-03-18
JP2007011005A2007-01-18
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Other References:
JOURNAL OF THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, vol. 6924, 2008, pages 692420
ACS NANO, vol. 4, no. 8, pages 4815 - 4823
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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