Title:
ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/202345
Kind Code:
A1
Abstract:
The present invention provides: an actinic-ray-sensitive or radiation-sensitive resin composition comprising (A) a resin which decomposes by the action of an acid to increase in polarity and (B) a compound which generates an acid upon irradiation with actinic rays or radiation, wherein the resin (A) and the acid generated from the compound (B) form a bond by the action of actinic rays or radiation or of the acid; an actinic-ray-sensitive or radiation-sensitive film formed using the actinic-ray-sensitive or radiation-sensitive resin composition; a method for forming a pattern using the actinic-ray-sensitive or radiation-sensitive resin composition; and a method for producing an electronic device.
Inventors:
HATAKEYAMA NAOYA (JP)
GOTO AKIYOSHI (JP)
ISHIHARA HIDEYUKI (JP)
SHIRAKAWA MICHIHIRO (JP)
BEKKI YOSUKE (JP)
GOTO AKIYOSHI (JP)
ISHIHARA HIDEYUKI (JP)
SHIRAKAWA MICHIHIRO (JP)
BEKKI YOSUKE (JP)
Application Number:
PCT/JP2022/010426
Publication Date:
September 29, 2022
Filing Date:
March 09, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C309/12; C07C311/09; C07C317/14; C07D211/96; C07D327/06; C07D333/76; C08F212/14; C08F220/20; C08F220/26; C08F220/38; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Foreign References:
| JP2020181064A | 2020-11-05 | |||
| JP2013209360A | 2013-10-10 | |||
| JP2018115153A | 2018-07-26 | |||
| JP2015081960A | 2015-04-27 | |||
| JP2012247502A | 2012-12-13 | |||
| JP2012189884A | 2012-10-04 | |||
| JP2012083385A | 2012-04-26 | |||
| JP2012018304A | 2012-01-26 | |||
| JP2006063025A | 2006-03-09 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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