Title:
ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/120250
Kind Code:
A1
Abstract:
Provided is an actinic-ray-sensitive or radiation-sensitive resin composition, etc. that, when forming an ultra-fine pattern (for example, a line and space pattern of 25 nm or less, or a hole pattern with a hole diameter of 25 nm or less, etc.), has an extremely excellent pattern shape. The actinic-ray-sensitive or radiation-sensitive resin composition includes a resin, and an ionic compound comprising a group represented by -SF4R on at least one of a cation part and an anion part.
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Inventors:
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
GOTO AKIYOSHI (JP)
Application Number:
PCT/JP2022/045518
Publication Date:
June 29, 2023
Filing Date:
December 09, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C25/18; C07C309/06; C07C309/12; C07C309/42; C07C309/65; C07C311/53; C07C381/00; C07C381/12; C07D307/00; C07D317/72; C07D321/10; C07D327/06; C07D333/76; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2020105346A1 | 2020-05-28 | |||
WO2022270134A1 | 2022-12-29 | |||
WO2018193954A1 | 2018-10-25 | |||
WO2020004306A1 | 2020-01-02 | |||
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Foreign References:
JP2016040240A | 2016-03-24 | |||
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JP2013061648A | 2013-04-04 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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