Title:
ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/157635
Kind Code:
A1
Abstract:
The present invention provides an actinic-ray-sensitive or a radiation-sensitive resin composition having excellent roughness performance and roughness performance after the passage of time. This actinic-ray-sensitive or radiation-sensitive resin composition contains: a compound (Q) represented by a specific general formula (I-1); and a resin, the polarity of which increases as a result of being decomposed by the effect of an acid.
Inventors:
UEMURA MINORU (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
FUJIMAKI NISHIKI (JP)
HIURA NOBUHIRO (JP)
MARUMO KAZUHIRO (JP)
MORI TAKAHIRO (JP)
SHIRAKAWA MICHIHIRO (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
FUJIMAKI NISHIKI (JP)
HIURA NOBUHIRO (JP)
MARUMO KAZUHIRO (JP)
MORI TAKAHIRO (JP)
SHIRAKAWA MICHIHIRO (JP)
Application Number:
PCT/JP2023/003132
Publication Date:
August 24, 2023
Filing Date:
February 01, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C311/51; C07C381/12; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
| WO2021251083A1 | 2021-12-16 |
Foreign References:
| JP2001330947A | 2001-11-30 |
Attorney, Agent or Firm:
KOH-EI, P.C. et al. (JP)
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