Title:
ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/048397
Kind Code:
A1
Abstract:
Provided are: an actinic-ray-sensitive or radiation-sensitive resin composition having excellent resolution, LWR performance, and PED stability; an actinic-ray-sensitive or radiation-sensitive film that uses the actinic-ray-sensitive or radiation-sensitive resin composition; a pattern formation method; and an electronic device manufacturing method. Provided are: an actinic-ray-sensitive or radiation-sensitive resin composition containing a resin (P) including a repeating unit having a phenolic hydroxyl group and a repeating unit having an acid decomposable group, a compound (A) in which an acid having a pKa of less than 0 is generated upon irradiation by an actinic ray or a radiation ray, and an acid diffusion control agent (B), in which at least one of the compound (A) and the acid diffusion control agent (B) are a specific compound, and the content of the acid diffusion control agent (B) is 80 mol% or more relative to the content of the compound (A); an actinic-ray-sensitive or radiation-sensitive film that uses the actinic-ray-sensitive or radiation-sensitive resin composition; a pattern formation method; and an electronic device manufacturing method.
Inventors:
KAMINO YUKA (JP)
YOSHIOKA TOMOAKI (JP)
YOSHINO FUMIHIRO (JP)
YOSHIOKA TOMOAKI (JP)
YOSHINO FUMIHIRO (JP)
Application Number:
PCT/JP2023/030369
Publication Date:
March 07, 2024
Filing Date:
August 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
| WO2022172689A1 | 2022-08-18 | |||
| WO2017115629A1 | 2017-07-06 |
Attorney, Agent or Firm:
KOH-EI, P.C. (JP)
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