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Title:
ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/175270
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an active light-sensitive or radiation-sensitive resin composition which is not susceptible to development defects after long-term storage and is suppressed in deterioration of LWR. An active light-sensitive or radiation-sensitive resin composition according to the present invention contains (A) at least two photoacid generators and (B) a resin which is decomposed by the action of an acid, thereby being increased in the solubility in alkali developer liquids. The photoacid generators include at least a photoacid generator represented by general formula (A-1) and a photoacid generator represented by general formula (A-2).

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Inventors:
KITAMURA TETSU (JP)
SHIBUYA AKINORI (JP)
KOJIMA MASAFUMI (JP)
KATO KEITA (JP)
Application Number:
PCT/JP2014/061294
Publication Date:
October 30, 2014
Filing Date:
April 22, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/038; G03F7/039; G03F7/32
Foreign References:
JP2012008500A2012-01-12
JP2012113003A2012-06-14
JP2012159688A2012-08-23
JP2013033161A2013-02-14
JP2013068778A2013-04-18
US20130084438A12013-04-04
JP2013130735A2013-07-04
JP2013235255A2013-11-21
JP2014133723A2014-07-24
Attorney, Agent or Firm:
ODAHARA Shuichi et al. (JP)
Shuichi Odawara (JP)
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