Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/154345
Kind Code:
A1
Abstract:
The present invention provides: an active light sensitive or radiation sensitive resin composition which is capable of forming a pattern that has low LWR and is suppressed in collapsing; a resist film; a pattern forming method; and a method for manufacturing an electronic device. An active light sensitive or radiation sensitive resin composition according to the present invention contains a photoacid generator represented by general formula (1) or a resin having a residue that is obtained by removing one hydrogen atom from the photoacid generator represented by general formula (1).
Inventors:
NISHIO RYO (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
TSUCHIMURA TOMOTAKA (JP)
SHIRAKAWA MICHIHIRO (JP)
KATO KEITA (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
TSUCHIMURA TOMOTAKA (JP)
SHIRAKAWA MICHIHIRO (JP)
KATO KEITA (JP)
Application Number:
PCT/JP2017/000986
Publication Date:
September 14, 2017
Filing Date:
January 13, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C309/12; C07C309/17; C07C381/12; G03F7/038; G03F7/039; G03F7/20
Foreign References:
| JP2014066925A | 2014-04-17 | |||
| JP2014063160A | 2014-04-10 | |||
| JP2012133053A | 2012-07-12 | |||
| JP2013156416A | 2013-08-15 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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