Title:
ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/116915
Kind Code:
A1
Abstract:
Provided are: an active light sensitive or radiation sensitive resin composition which is configured such that the exposure latitude EL and the aerial image log-slope NILS satisfy a relational expression represented by a specific formula, and which enables the achievement of extremely excellent roughness performance, exposure latitude and depth of focus especially during the formation of an ultrafine pattern (for example, a contact hole pattern having a hole diameter of 45 nm or less, or a line-and-space pattern having a line width of 45 nm or less); and an active light sensitive or radiation sensitive film, a pattern forming method and a method for producing an electronic device, each of which uses this active light sensitive or radiation sensitive resin composition.
Inventors:
KATO KEITA (JP)
SAKITA KYOUHEI (JP)
ASAKAWA DAISUKE (JP)
GOTO AKIYOSHI (JP)
KOJIMA MASAFUMI (JP)
SAKITA KYOUHEI (JP)
ASAKAWA DAISUKE (JP)
GOTO AKIYOSHI (JP)
KOJIMA MASAFUMI (JP)
Application Number:
PCT/JP2017/044597
Publication Date:
June 28, 2018
Filing Date:
December 12, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/038; G03F7/039; G03F7/20
Foreign References:
| JP2014126767A | 2014-07-07 | |||
| JP2015138232A | 2015-07-30 | |||
| JP2015087749A | 2015-05-07 | |||
| JP2015108809A | 2015-06-11 | |||
| JP2016075901A | 2016-05-12 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. et al. (JP)
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