Title:
ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN FILM, PATTERN-FORMING METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2020/202944
Kind Code:
A1
Abstract:
Provided is an active light-sensitive or radiation-sensitive resin composition, etc., that is capable of forming a pattern having an extremely excellent rectangular shape in the cross-section thereof, when forming a pattern having an extremely high cross-section aspect ratio from a thick active light-sensitive radiation-sensitive film. This active light-sensitive or radiation-sensitive resin composition includes: a resin (A) having increased polarity due to the use of acid; a compound (B) generating acid as a result of irradiation by active light or radiation; and a compound (C) indicated by a specific structure and having a molecular weight of at least 220.
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Inventors:
HATAKEYAMA NAOYA (JP)
YONEKUTA YASUNORI (JP)
TOMIGA TAKAMITSU (JP)
HIGASHI KOHEI (JP)
YONEKUTA YASUNORI (JP)
TOMIGA TAKAMITSU (JP)
HIGASHI KOHEI (JP)
Application Number:
PCT/JP2020/008266
Publication Date:
October 08, 2020
Filing Date:
February 28, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C07D207/16; C07D211/60; C07D211/62; C07D295/205; C07D405/12; C07D411/12; C07D493/14; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Foreign References:
| JP2011057663A | 2011-03-24 | |||
| JP2012072062A | 2012-04-12 | |||
| JP2014235432A | 2014-12-15 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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