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Title:
ACTIVE LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2022/220201
Kind Code:
A1
Abstract:
The present invention provides: an active light-sensitive or radiation-sensitive resin composition which contains a compound represented by general formula (S1) and an acid-decomposable resin; a resist film which is formed using this active light-sensitive or radiation-sensitive resin composition; a pattern forming method using this active light-sensitive or radiation-sensitive resin composition; a method for producing an electronic device, the method using this active light-sensitive or radiation-sensitive resin composition; an active light-sensitive or radiation-sensitive resin composition which enables, if used for the formation of a pattern, the achievement of a pattern that has an excellent shape due to a compound represented by general formula (S1); a resist film which is formed using this active light-sensitive or radiation-sensitive resin composition; a pattern forming method using this active light-sensitive or radiation-sensitive resin composition; a method for producing an electronic device, the method using this active light-sensitive or radiation-sensitive resin composition; and a compound which is able to be used for this active light-sensitive or radiation-sensitive resin composition. In the formula, each of Q1 to Q5 independently represents a hydrogen atom or a substituent, provided that at least one of the Q1 to Q5 moieties represents a substituent that contains an aryloxy group represented by general formula (QR1); Lq1 represents a single bond or a divalent linking group; M+ represents a cation; each of G1 to G5 independently represents a hydrogen atom or a substituent, provided that at least one of the G1 to G5 moieties represents a substituent that contains an ester group; and * represents a bonding position.

Inventors:
BEKKI YOSUKE (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
FUJIMAKI NISHIKI (JP)
Application Number:
PCT/JP2022/017419
Publication Date:
October 20, 2022
Filing Date:
April 08, 2022
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C309/06; C07C309/12; C07C309/17; C07C309/40; C07C309/42; C07C311/53; C07C381/12; C07D307/00; C07D307/12; C07D309/12; C07D493/18; C09K3/00; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2018193954A12018-10-25
WO2020066824A12020-04-02
WO2020158337A12020-08-06
WO2020004306A12020-01-02
WO2018019395A12018-02-01
Foreign References:
JP2014199358A2014-10-23
JP2014029481A2014-02-13
JP2014199357A2014-10-23
JP2013160955A2013-08-19
JP2004109976A2004-04-08
JP2014041327A2014-03-06
JP2014098921A2014-05-29
US20160070167A12016-03-10
US20150004544A12015-01-01
US20160237190A12016-08-18
US20160274458A12016-09-22
JP2014059543A2014-04-03
JP2013061648A2013-04-04
JP2021070036A2021-05-06
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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