ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Title:

ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2022/270230

Kind Code:

A1

Abstract:

Provided is an active-light-sensitive or radiation-sensitive resin composition that yields a pattern having exceptional cross-sectional rectangularity. This active-light-sensitive or radiation-sensitive resin composition contains: a resin having a group that decomposes under the action of an acid to generate a polar group; an onium salt (I) that generates an acid represented by formula (1) upon exposure to active light rays or radiation; and an onium salt (II) composed of an anion site A and a cation site M, the onium salt (II) having at least one structural site W that forms an acidic site represented by HA upon exposure to active light rays or radiation. The acid dissociation constant derived from the acidic site represented by HA, obtained by replacing the cationic site in the structural site W with H+, is greater than the acid dissociation constant of the acid represented by formula (1).

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Inventors:

KOJIMA MASAFUMI (JP)
BEKKI YOSUKE (JP)
HIURA NOBUHIRO (JP)

Application Number:

PCT/JP2022/021808

Publication Date:

December 29, 2022

Filing Date:

May 27, 2022

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

G03F7/004; C07C25/02; C07C62/24; C07C63/70; C07C65/05; C07C65/10; C07C233/91; C07C309/07; C07C309/17; C07C309/65; C07C311/03; C07C311/48; C07C311/51; C07C317/22; C07C381/04; C07C381/12; G03F7/038; G03F7/039; G03F7/20

Domestic Patent References:

WO2020261753A1

2020-12-30

Foreign References:

JP2011209660A	2011-10-20
JP2007052346A	2007-03-01

Attorney, Agent or Firm:

YONEKURA Junzo et al. (JP)

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