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Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND POLYESTER
Document Type and Number:
WIPO Patent Application WO/2019/187804
Kind Code:
A1
Abstract:
Provided are: an active-ray-sensitive or radiation-sensitive resin composition which has such a property that an immersion liquid prepared from the composition can exhibit high followability to an exposure device and which enables the formation of a good pattern form; and others. The active-ray-sensitive or radiation-sensitive resin composition comprises a resin which has a group capable of being decomposed by the action of an acid to increase the polarity thereof, a polyester, and a photo-acid generator, wherein the polyester has a group which has an active proton, an anionic group which is generated as the result of the dissociation of an active proton from a group having an active proton and which forms a salt structure in conjunction with a cation, or a group which has such a structure that a group having an active proton is protected by a protective group.

Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2019/006190
Publication Date:
October 03, 2019
Filing Date:
February 20, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C08G63/00; G03F7/039; G03F7/20
Foreign References:
JP2002287345A2002-10-03
JP2017008425A2017-01-12
JP2007002045A2007-01-11
JP2014063148A2014-04-10
JP2017090674A2017-05-25
JP2003261657A2003-09-19
JP2004331981A2004-11-25
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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