Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR FORMING POSITIVE-WORKING PATTERN, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/172597
Kind Code:
A1
Abstract:
Provided is an active-ray-sensitive or radiation-sensitive resin composition which has excellent long-term stability and enables the formation of a pattern having excellently reduced LWR. Also provided are a resist film, a method for forming a positive-working pattern, and a method for manufacturing an electronic device, each of which is associated with the active-ray-sensitive or radiation-sensitive resin composition. The active-ray-sensitive or radiation-sensitive resin composition comprises a resin (A) which has a repeating unit (a) and a basic compound of which a conjugate acid has a pKa value of 13.00 or less, in which the repeating unit (a) has a nonionic group from which a leaving group is detached therefrom upon the irradiation with an active ray or a radioactive ray to generate an acid, a repeating unit produced by substituting the leaving group by a hydrogen atom has a molecular weight of 300 or less, and the amount of the repeating unit (a) relative to the total solid content of the active-ray-sensitive or radiation-sensitive resin composition is a specified amount.
Inventors:
YAMAGUCHI SHUHEI (JP)
MIYOSHI TARO (JP)
MIYOSHI TARO (JP)
Application Number:
PCT/JP2021/047008
Publication Date:
August 18, 2022
Filing Date:
December 20, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F212/14; C08F220/38; C08F220/54; C08F228/02; G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
WO2016158711A1 | 2016-10-06 | |||
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Foreign References:
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Other References:
TERUO NAGAO: "Improvement of molecular surface area and volume calculation program", BULLETIN OF HAKODATE NATIONAL COLLEGE OF TECHNOLOGY, no. 27, 1993, pages 111 - 120
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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