ADDITION-CURING SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM

Title:

ADDITION-CURING SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM

Document Type and Number:

WIPO Patent Application WO/2021/157191

Kind Code:

A1

Abstract:

An addition-curing silicone pressure-sensitive adhesive composition which contains no noncrosslinking organpolysiloxane resin and comprises 100 parts by mass of (A) an organopolysiloxane having, in the molecule, at least two alkenyl groups which combine with silicon atoms and having a 25°C viscosity of 0.01-1,000 Pa·s, 5-500 parts by mass of (B) an organopolysiloxane resin having an alkenyl group, (C) an organohydrogenpolysiloxane having, in the molecule, two or more silicon-atom-bonded hydrogen atoms, the amount of (C) being such that the amount of the silicon-atom-bonded hydrogen atoms contained in the (C) component is 0.1-5.0 times by mole the total amount of all the silicon-atom-bonded alkenyl groups contained in the composition, and (D) a catalyst based on a platinum-group metal. The addition-curing silicone pressure-sensitive adhesive composition has excellent tackiness as a temporary fixer and gives cured objects with very little component migration.

Inventors:

OTAKE KOHEI (JP)
KITAGAWA TAICHI (JP)
MATSUMOTO NOBUAKI (JP)
OZAI TOSHIYUKI (JP)

Application Number:

PCT/JP2020/046035

Publication Date:

August 12, 2021

Filing Date:

December 10, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SHINETSU CHEMICAL CO (JP)

International Classes:

C09J9/02; C09J7/20; C09J7/38; C09J11/04; C09J183/05; C09J183/07

Domestic Patent References:

WO2019124417A1	2019-06-27
WO2019065398A1	2019-04-04

Foreign References:

JP2009030028A	2009-02-12
JP5825738B2	2015-12-02
JP2631098B2	1997-07-16
JP5234064B2	2013-07-10

Other References: