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Title:
ADDITIVE FOR CHEMICAL-MECHANICAL POLISHING, METHOD FOR MANUFACTURING SAME, AND POLISHING LIQUID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/084951
Kind Code:
A1
Abstract:
An additive according to the present invention is configured so as to be used in chemical-mechanical polishing and contains a polymer (P). The polymer (P) has a structural unit (A) derived from a vinyl monomer having a -(LO)n-R group; the total content of structural units derived from monomers including one or more functional groups selected from the group consisting of a carboxylic acid group, a phosphoric acid group, a phosphonic acid group, a sulfuric acid group, a sulfonic acid group, and salts thereof is 0-0.6 mass%; and the polydispersity index (PDI) represented by the weight average molecular weight/number average molecular weight of the polymer (P) is 2.0 or less. (Note that L is an alkylene group having a carbon number of 4 or less, n is any integer from 3 to 150, and R is a hydrogen atom or a monovalent hydrocarbon group having a carbon number of 1 to 4.)

Inventors:
IMURA SACHIKO (JP)
SHIBATA AKITSUGU (JP)
GOTOU AKIHIRO (JP)
KANBE SHINYA (JP)
Application Number:
PCT/JP2022/037217
Publication Date:
May 19, 2023
Filing Date:
October 05, 2022
Export Citation:
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Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C09G1/02; B24B37/00; C08K3/22; C08K3/36; C08L101/02; C09K3/14; H01L21/304
Domestic Patent References:
WO2016104611A12016-06-30
WO2009104334A12009-08-27
Foreign References:
JP2019121795A2019-07-22
JP2013043893A2013-03-04
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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