Title:
ADDITIVE FOR ELECTROPLATING SOLUTION, ELECTROPLATING SOLUTION, ELECTROPLATING METHOD, AND METHOD FOR MANUFACTURING METAL LAYER
Document Type and Number:
WIPO Patent Application WO/2022/172823
Kind Code:
A1
Abstract:
Provided is an additive for an electroplating solution, the additive containing a reaction product between at least one type of epoxy compound (a1) represented by general formula (1) and at least one type of tertiary amine compound (a2). [Chemical 1] (In the formula, L1 and L2 each independently denote a hydrogen atom, an alkyl group having 1-5 carbons, or a group represented by general formulas (L-1) to (L-3), and n denotes an integer of 1-5.) [Chemical 2] (In the formula, m1 to m3 each independently denote an integer of 1-5, and * denotes a bond.)
Inventors:
TAKAHASHI TAKUYA (JP)
ISHIWATA SHINYA (JP)
HATSUKADE TOMOKO (JP)
ISHIWATA SHINYA (JP)
HATSUKADE TOMOKO (JP)
Application Number:
PCT/JP2022/004007
Publication Date:
August 18, 2022
Filing Date:
February 02, 2022
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C25D3/38; C07D251/32; C25D7/00; C25D7/12
Domestic Patent References:
| WO2011135716A1 | 2011-11-03 |
Foreign References:
| US20180237932A1 | 2018-08-23 | |||
| JPS5661374A | 1981-05-26 | |||
| JP2006037232A | 2006-02-09 | |||
| JP2011207878A | 2011-10-20 | |||
| JP2013249515A | 2013-12-12 | |||
| US3879270A | 1975-04-22 | |||
| CN101555609A | 2009-10-14 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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