Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT FILM, CONNECTION STRUCTURE BODY, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/058218
Kind Code:
A1
Abstract:
An adhesive agent composition comprising: a radical-polymerizable compound; a radical polymerization initiator; a compound having a nitrogen-containing aromatic heterocyclic ring; and particles containing at least one metal compound selected from the group consisting of metal hydroxides and metal oxides.

Inventors:
YOSHIDA HIDEKI (JP)
KUDO SUNAO (JP)
Application Number:
PCT/JP2023/033398
Publication Date:
March 21, 2024
Filing Date:
September 13, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
RESONAC CORP (JP)
International Classes:
C09J4/00; C09J7/10; C09J7/30; C09J11/04; C09J11/06
Domestic Patent References:
WO2017090659A12017-06-01
WO2022025207A12022-02-03
WO2019142791A12019-07-25
WO2007046189A12007-04-26
Foreign References:
JP2014074139A2014-04-24
JP2012160546A2012-08-23
JP2002167569A2002-06-11
JP2021123655A2021-08-30
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: MEASURING DEVICE

Next Patent: POWER STORAGE DEVICE