Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE AGENT COMPOSITION AND ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2012/011265
Kind Code:
A1
Abstract:
Disclosed is an adhesive agent composition that does not use halogens, has excellent adhesive strength, long-term reliability, and workability, and is suitable for use in anisotropic conductive paste favorably used in connecting substrates. Further disclosed is an adhesive film that is obtained by using the adhesive agent composition, can be stored at room temperature, and has excellent attachment/removal properties. The adhesive agent composition comprises a total of 10-300 parts by weight of one or at least two compounds selected from a styrene-isobutylene-styrene olefin elastomer, a styrene-ethylene-butylene-styrene olefin elastomer, and a maleic anhydride modification product thereof for every 100 parts by weight of a polyetheresteramide.

Inventors:
KINOSHITA JUNICHI (JP)
TERADA TSUNEHIKO (JP)
Application Number:
PCT/JP2011/004058
Publication Date:
January 26, 2012
Filing Date:
July 15, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TATSUTA DENSEN KK (JP)
KINOSHITA JUNICHI (JP)
TERADA TSUNEHIKO (JP)
International Classes:
C09J177/12; C09J7/00; C09J9/02; C09J11/04; C09J133/00; C09J153/02; C09J163/00; C09J175/04
Domestic Patent References:
WO2010084722A12010-07-29
Foreign References:
JPS61108676A1986-05-27
JPH04231083A1992-08-19
JPS6386781A1988-04-18
JP2001354938A2001-12-25
JPH093323A1997-01-07
Attorney, Agent or Firm:
TSUTADA, Akiko et al. (JP)
Shoko Tsutada (JP)
Download PDF:
Claims: