Title:
ADHESIVE AGENT COMPOSITION, ADHESIVE AGENT LAYER, AND ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/145601
Kind Code:
A1
Abstract:
Provided is an adhesive agent composition in which a constituent resin thereof has excellent hydrolysis resistance and from which an adhesive agent layer having a low dielectric constant can be formed. Provided is an adhesive agent composition that contains a polyester resin including: a structural unit derived from a polyol having at least 20 carbon atoms; and a structural unit derived from an aromatic polycarboxylic acid. The dielectric constant of the adhesive agent composition is preferably at most 4.0 at a frequency of 100 kHz when the adhesive agent layer is formed. In addition, provided is an adhesive agent layer formed from the adhesive agent composition.
Inventors:
SHIBANO MASAYA (JP)
KATAMI HIROFUMI (JP)
KATAMI HIROFUMI (JP)
Application Number:
PCT/JP2023/001525
Publication Date:
August 03, 2023
Filing Date:
January 19, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J167/00; C09J7/38
Domestic Patent References:
| WO2021200716A1 | 2021-10-07 | |||
| WO2022019260A1 | 2022-01-27 |
Foreign References:
| JP2020175560A | 2020-10-29 | |||
| JP2013039784A | 2013-02-28 | |||
| JP2017171819A | 2017-09-28 | |||
| JP2015105286A | 2015-06-08 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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