ADHESIVE AGENT FOR MEDICAL DEVICES, CURED ARTICLE, MEDICAL DEVICE MEMBER, MEDICAL DEVICE, AND METHOD FOR MANUFACTURING MEDICAL DEVICE

Title:

ADHESIVE AGENT FOR MEDICAL DEVICES, CURED ARTICLE, MEDICAL DEVICE MEMBER, MEDICAL DEVICE, AND METHOD FOR MANUFACTURING MEDICAL DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/199730

Kind Code:

A1

Abstract:

Provided are: an adhesive agent for medical devices, which contains the below-mentioned components (a) to (e) in specified amounts; a cured article; a medical device member; a medical device; and a method for manufacturing a medical device. (a) An epoxy resin that comprises at least one of a bisphenol A-type epoxy resin and a bisphenol F-type epoxy resin; (b) an imidazole compound that does not contain a hetero atom other than a ring-constituting nitrogen atom and has a melting point of lower than 60°C; (c) a phenolic resin that has a liquid form at 25°C; (d) fumed silica that has an average particle diameter of 5 nm to 35 nm inclusive; and (e) talc.

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Inventors:

FURUKAWA KAZUSHI (JP)
NAKAI YOSHIHIRO (JP)

Application Number:

PCT/JP2023/011954

Publication Date:

October 19, 2023

Filing Date:

March 24, 2023

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C09J163/02; A61L31/10; C09J11/04; C09J11/06; C09J161/04; A61B1/00

Domestic Patent References:

WO2020175277A1

2020-09-03

Foreign References:

JP2011026457A	2011-02-10
JP2019041873A	2019-03-22
JP4875790B2	2012-02-15
US20080251203A1	2008-10-16
CN113185804A	2021-07-30